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Call Us At:
+66 2-124-3286
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sales@vlk.th.com
cs1@vlk.th.com
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36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
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LOCTITE® ABLESTIK CE 3920
LOCTITE® ABLESTIK CE 3920
A 1-part, low-temperature curing, electrically conductive die-attach adhesive designed for SMD interconnect formation and stencil/screen printing.
Attach / Potting
Epoxy
Heat Cure
Single Component
LOCTITE® ABLESTIK CE 8500
LOCTITE® ABLESTIK CE 8500
A 1-part, solventless electrically conductive adhesive that combines low stress with good adhesion on nearly all surfaces, and has an operating temperature of -45°C to 200°C (-49°F to 392°F).
Heat Cure
Paste
Single Component
LOCTITE® ABLESTIK CE 8500-S110
LOCTITE® ABLESTIK CE 8500-S110
LOCTITE ABLESTIK CE 8500-S110, Modified Epoxy, Component Assembly, Electrically Conductive Adhesive
Epoxy
Heat Cure
Single Component
LOCTITE® ABLESTIK CF 3350
LOCTITE® ABLESTIK CF 3350
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
Film
Heat Cure
LOCTITE® ABLESTIK CT 4042-30
LOCTITE® ABLESTIK CT 4042-30
LOCTITE ABLESTIK CT 4042-30, Epoxy, Assembly
Epoxy
Heat Cure
Single Component
LOCTITE® ABLESTIK CT 5047-2
LOCTITE® ABLESTIK CT 5047-2
A 1-part, low-temperature cure adhesive designed to make electrical connections where hot soldering is impractical, or to conductive plastics where high temperatures aren’t possible.
Heat Cure
Metals
Plastics
Single Component
Two Component
LOCTITE® ABLESTIK DX20C
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Attach / Potting
Heat Cure
LOCTITE® ABLESTIK E 3040
LOCTITE® ABLESTIK E 3040
LOCTITE ABLESTIK E 3040, Epoxy, Assembly
Epoxy
Heat Cure
Single Component
LOCTITE® ABLESTIK E 3508 MOD3
LOCTITE® ABLESTIK E 3508 MOD3
LOCTITE ABLESTIK E 3508 MOD3, Epoxy, Adhesive, Sealant, Assembly
Epoxy
Heat Cure
Sealing
Single Component
LOCTITE® ABLESTIK E 3517
LOCTITE® ABLESTIK E 3517
LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant
Epoxy
Heat Cure
Sealing
Single Component
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