From reflow to wave to rework, our solder portfolio has the forms you need. Choose no-clean or water-soluble pastes (Type 4/5) optimized for low voiding under BTCs; solder wire and bar for line maintenance; precision preforms with bond-line control for die attach/thermal interfaces; and BGA/CSP spheres. We stock automotive-grade SAC and low-silver lead-free systems, plus low-temperature SnBi for heat-sensitive builds, from leaders like Interflux and MacDermid Alpha. Expect stable stencil transfer, consistent wetting, reliable through-hole fill, and strong thermal-cycle/vibration performance—backed by process guidance and compatible cleaners/thinners.
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