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+66 2 150-0247 to 51
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cs1@vlk.th.com
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36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
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Alloy Compatibility
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Application Method
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Flux Family
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Form Factor
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Key Features
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PCB Finish Compatibility
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Solvent System / VOC
IF 8001
IF 8001
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications, typically used in hand soldering and rework and repair.
No-clean
Alcohol-Based
Selective Soldering
Flux Pen
Lead-Free (pb-Free)
IF 8300
IF 8300
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.
No-clean
Reflow Soldering
Dip Soldering
Flux Gel
Tacky Flux
OSPI 3311M
OSPI 3311M
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles. OSPI 3311M provides optimised through hole fill on degraded OSP finishes.
No-clean
Alcohol-Based
Wave Soldering
Selective Soldering
Reflow Soldering
PacIFic 2009M
PacIFic 2009M
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
No-clean
VOC-Free
Water-Based
Wave Soldering
Selective Soldering
PacIFic 2009MLF
PacIFic 2009MLF
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
No-clean
VOC-Free
Water-Based
Wave Soldering
Selective Soldering
PacIFic 2009MLF-E
PacIFic 2009MLF-E
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
No-clean
VOC-Free
Water-Based
Wave Soldering
Selective Soldering
PacIFic 2010F
PacIFic 2010F
Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.
No-clean
VOC-Free
Water-Based
Wave Soldering
Spray Application
SelectIF 2040
SelectIF 2040
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
No-clean
VOC-Free
Water-Based
Selective Soldering
Jetting
T 2005M
T 2005M
Interflux® T 2005M is the designated thinner for the IF 2005-series of fluxes. Flux thinning is typically done in open flux systems that involve evaporation of the flux solvent like in foam fluxing.
Alcohol-Based
Foam Application
Halogen-Free
TerrIFic RP65
TerrIFic RP65
TerrIFic RP65 is a no-clean water based soldering flux for selective fluxing applications, typically used in hand soldering and rewok and repair.
No-clean
VOC-Free
Water-Based
Selective Soldering
Flux Pen
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