AccuFlux® Preforms: ALPHA® AccuFlux® BTC-578
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.
ALPHA AccuFlux BTC-578 technology features a precision-controlled micro-flux coating on solder preforms. The chemistry is specifically designed to reduce voiding at the thermal/ground interface of bottom terminated component (BTC) packages, such as QFN, QFP, and D-Pak.
By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable flux residues are achieved, meeting the most demanding electrochemical reliability requirements. This technology can easily be integrated into existing SMT circuit assembly processes.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteAccuFlux® Preforms: ALPHA® AccuFlux® BTC-578
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.
ALPHA AccuFlux BTC-578 technology features a precision-controlled micro-flux coating on solder preforms. The chemistry is specifically designed to reduce voiding at the thermal/ground interface of bottom terminated component (BTC) packages, such as QFN, QFP, and D-Pak.
By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable flux residues are achieved, meeting the most demanding electrochemical reliability requirements. This technology can easily be integrated into existing SMT circuit assembly processes.
Get pricing for [Product Name]
We'll respond within 24 hours during business days.
