AccuFlux® Preforms: ALPHA® AccuFlux® BTC-578
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.
ALPHA AccuFlux BTC-578 technology features a precision-controlled micro-flux coating on solder preforms. The chemistry is specifically designed to reduce voiding at the thermal/ground interface of bottom terminated component (BTC) packages, such as QFN, QFP, and D-Pak.
By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable flux residues are achieved, meeting the most demanding electrochemical reliability requirements. This technology can easily be integrated into existing SMT circuit assembly processes.
