ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux residue is clear, colorless, and provides excellent electrochemical reliability.

The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point and the narrowest pasty range during melting and re-solidification, maximizing resistance to thermal-cycle-based fatigue in traditional low-temperature alloy applications. The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used.

All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.

ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux residue is clear, colorless, and provides excellent electrochemical reliability.

The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point and the narrowest pasty range during melting and re-solidification, maximizing resistance to thermal-cycle-based fatigue in traditional low-temperature alloy applications. The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used.

All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.