ALPHA® JP-501
A low temperature, lead-free, no-clean solder paste designed for use in jet printers.
The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA JP-501 is clear and colorless, and is formulated to provide high electrical reliability in a zero-halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteALPHA® JP-501
A low temperature, lead-free, no-clean solder paste designed for use in jet printers.
The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA JP-501 is clear and colorless, and is formulated to provide high electrical reliability in a zero-halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.
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