ALPHA® OM-5100 Solder Paste
Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle.
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) BGA components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteALPHA® OM-5100 Solder Paste
Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle.
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) BGA components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Get pricing for [Product Name]
We'll respond within 24 hours during business days.
