
Lead-free, zero halogen, no-clean solder paste suitable for jet printers and approved by leading jetting equipment manufacturers.
ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in-circuit pin test yields and high electrochemical reliability. ALPHA JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes.