ALPHA® JP-501
A low temperature, lead-free, no-clean solder paste designed for use in jet printers.
The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA JP-501 is clear and colorless, and is formulated to provide high electrical reliability in a zero-halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.
