ALPHA® OM-362 Solder Paste

ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is specifically designed to deliver ultra-low voiding performance across all component types, with a focus on bottom-terminated components.

ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on bottom terminated components (BTC). This paste is engineered for ultra-low voiding performance with high-reliability alloys such as Innolot® and traditional SAC alloys.