ALPHA® OM-565 HRL3 Solder Paste
A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C.
ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitive chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and offers superior wettability to minimize post-reflow defects, such as non-wet-open (NWO) and head-in-pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance compared to existing low-melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
