ALPHA® TrueHeight® Preforms
Engineered solder preforms with embedded bondline control to prevent tilt, address warpage, and ensure consistent joint thickness.
The ALPHA TrueHeight Solder Preform enhances the reliability of solder joints in semiconductor and electrical component attachments. Featuring embedded TrueHeight bond line control (BLC) technology, it regulates solder joint thickness, ensuring consistent reliability and optimal electrical and thermal performance under varying conditions.
