BERGQUIST® GAP PAD® TGP 10000ULM
This high performance, thermally conductive, silicone-based gap pad filler has an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteBERGQUIST® GAP PAD® TGP 10000ULM
This high performance, thermally conductive, silicone-based gap pad filler has an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
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