BERGQUIST® GAP PAD® TGP 3500ULM
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteBERGQUIST® GAP PAD® TGP 3500ULM
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
Get pricing for [Product Name]
We'll respond within 24 hours during business days.
