BERGQUIST® GAP PAD® TGP 7000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteBERGQUIST® GAP PAD® TGP 7000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
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