BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteBERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
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