BERGQUIST® GAP PAD® TGP HC5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteBERGQUIST® GAP PAD® TGP HC5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
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