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BERGQUIST® GAP FILLER TGF 1100SF

BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.

BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.

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36/7 Moo 13, Bungkumploy Sub-District,
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sales@vlk.th.com
cs1@vlk.th.com
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