BERGQUIST® GAP FILLER TGF 3000SF
This blue, 2-part, silicone-free gap filler is designed for high-throughput assembly applications.
BERGQUIST® GAP FILLER TGF 3000SF is a 2-part, silicone-free gap filler for thermal management on high-throughput, silicone-sensitive assembly applications, such as power storage devices and charging equipment. After mixing, this blue gap filler maintains low compression stress during assembly, cures at room temperature and offers 3.0 W/m-K thermal conductivity.
