BERGQUIST® GAP PAD® TGP 1000VOUS
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD® TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
