BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced gap filling material is recommended for low-stress applications requiring a mid to high thermally conductive interface material.
BERGQUIST® GAP PAD® TGP 2000 is highly conformable, so the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
