BERGQUIST® GAP PAD® TGP 7000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
