BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
