BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
