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LOCTITE® 3129

A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.

Description

LOCTITE® 3129 is a 1-part, heat-curable epoxy. It has been specifically designed to cure at low temperatures to provide excellent adhesion on a wide range of materials in under 10 minutes. It’s ideal where low curing temperatures are required for heat sensitive component, for example in memory cards and CCD/CMOS assemblies.

REQUEST A QUOTE
LOCTITE® 3129
A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Icon of a downward arrow with a horizontal line beneath it, symbolizing a download action.
Download Datasheet (PDF)
Looking for a different product?

We source any industrial chemical from our authorized brand network. Quote within 24 hours.

Request Sourcing Quote
REQUEST A QUOTE
LOCTITE® 3129
A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download icon showing a downward arrow entering a tray or container.
Download Datasheet (PDF)
Looking for a different product?

We source any industrial chemical from our authorized brand network. Quote within 24 hours.

Request Sourcing Quote

LOCTITE® 3129

A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.

Description

LOCTITE® 3129 is a 1-part, heat-curable epoxy. It has been specifically designed to cure at low temperatures to provide excellent adhesion on a wide range of materials in under 10 minutes. It’s ideal where low curing temperatures are required for heat sensitive component, for example in memory cards and CCD/CMOS assemblies.

REQUEST A QUOTE

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