LOCTITE® 3508NH
This 1-part, halogen-free epoxy underfill cures during Pb-free solder reflow while allowing self-alignment of IC components.
LOCTITE® 3508NH is a reliable underfill to protect electronic products from shock, drop and vibration. This black, 1-part, epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components, ultimately to improve the mechanical reliability of hand-held devices. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteLOCTITE® 3508NH
This 1-part, halogen-free epoxy underfill cures during Pb-free solder reflow while allowing self-alignment of IC components.
LOCTITE® 3508NH is a reliable underfill to protect electronic products from shock, drop and vibration. This black, 1-part, epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components, ultimately to improve the mechanical reliability of hand-held devices. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
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