Authorized Distributor in Thailand
LOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
Description
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
REQUEST A QUOTE
LOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
Looking for a different product?
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteREQUEST A QUOTE
LOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
Looking for a different product?
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteLOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
Description
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
REQUEST A QUOTE
Get pricing for [Product Name]
We'll respond within 24 hours during business days.
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