LOCTITE® ABLESTIK 2025D
This red non-conductive die-attach adhesive is designed for plastic ball grip array (PBGA), FlexBGA and Stacking BGA.
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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Request Sourcing QuoteLOCTITE® ABLESTIK 2025D
This red non-conductive die-attach adhesive is designed for plastic ball grip array (PBGA), FlexBGA and Stacking BGA.
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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