LOCTITE® ABLESTIK 2332
This solvent-free epoxy non-conductive adhesive develops a high bond strength when cured at temperatures as low as 100°C (212°F).
LOCTITE® ABLESTIK 2332 is a solventless epoxy non-conductive adhesive that develops a high bond strength when cured at temperatures as low as 100°C (212°F). It combines toughness at low temperatures with high peel and tensile shear strengths over a very broad temperature range. It is designed for use on a range of surfaces, in particular copper, aluminum, nickel, FRP and rigid plastics.
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Request Sourcing QuoteLOCTITE® ABLESTIK 2332
This solvent-free epoxy non-conductive adhesive develops a high bond strength when cured at temperatures as low as 100°C (212°F).
LOCTITE® ABLESTIK 2332 is a solventless epoxy non-conductive adhesive that develops a high bond strength when cured at temperatures as low as 100°C (212°F). It combines toughness at low temperatures with high peel and tensile shear strengths over a very broad temperature range. It is designed for use on a range of surfaces, in particular copper, aluminum, nickel, FRP and rigid plastics.
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