LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Request Sourcing QuoteLOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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