LOCTITE® ABLESTIK QMI529HT
A 1-part, BMI acrylate-based, conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteWe source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteLOCTITE® ABLESTIK QMI529HT
A 1-part, BMI acrylate-based, conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
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