LOCTITE® ABLESTIK QMI536NB
This semi-flexible hybrid-based electrically non-conductive adhesive is perfect for insulating die-attach applications.
LOCTITE® ABLESTIK QMI536NB is a low bleed, non-electrically conductive PTFE-filled paste. It has a fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Request Sourcing QuoteLOCTITE® ABLESTIK QMI536NB
This semi-flexible hybrid-based electrically non-conductive adhesive is perfect for insulating die-attach applications.
LOCTITE® ABLESTIK QMI536NB is a low bleed, non-electrically conductive PTFE-filled paste. It has a fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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