LOCTITE® ECCOBOND FP4530
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill

Description
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
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LOCTITE® ECCOBOND FP4530
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
Looking for a different product?
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteREQUEST A QUOTE
LOCTITE® ECCOBOND FP4530
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
Looking for a different product?
We source any industrial chemical from our authorized brand network. Quote within 24 hours.
Request Sourcing QuoteLOCTITE® ECCOBOND FP4530
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill

Description
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.







