LOCTITE® ECCOBOND FP4531
This 1-part, epoxy-based underfill encapsulant is perfect for use on flip-chips on flex applications with gaps down to 1 mm (0.04").
LOCTITE® ECCOBOND FP4531 is an epoxy-based underfill encapsulant formulated to flow easily into the small gaps on flex applications via capillary action. It has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
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Request Sourcing QuoteLOCTITE® ECCOBOND FP4531
This 1-part, epoxy-based underfill encapsulant is perfect for use on flip-chips on flex applications with gaps down to 1 mm (0.04").
LOCTITE® ECCOBOND FP4531 is an epoxy-based underfill encapsulant formulated to flow easily into the small gaps on flex applications via capillary action. It has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
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