LOCTITE® ECCOBOND UF 8830S
This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.
LOCTITE® ECCOBOND UF 8830S is a gray, high-purity underfill encapsulant. It's typically used for tight bump pitches and narrow gaps in flip-chip BGA applications, improving crack/fracture resistance and delivering faster flow. It exhibits a long staging time and work life and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. It is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Request Sourcing QuoteLOCTITE® ECCOBOND UF 8830S
This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.
LOCTITE® ECCOBOND UF 8830S is a gray, high-purity underfill encapsulant. It's typically used for tight bump pitches and narrow gaps in flip-chip BGA applications, improving crack/fracture resistance and delivering faster flow. It exhibits a long staging time and work life and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. It is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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