LOCTITE® 3508NH
This 1-part, halogen-free epoxy underfill cures during Pb-free solder reflow while allowing self-alignment of IC components.
LOCTITE® 3508NH is a reliable underfill to protect electronic products from shock, drop and vibration. This black, 1-part, epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components, ultimately to improve the mechanical reliability of hand-held devices. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
