LOCTITE® ABLESTIK 2035SC
This 1-part, electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
LOCTITE® ABLESTIK 2035SC is a 1-part, non-conductive adhesive formulated for use in high throughput die attach applications. It is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
