
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.
LOCTITE® ABLESTIK 8290 is a silver, electrically conductive die-attach adhesive for high-reliability leadframe packaging applications, recommended for die sizes up to 200 mm (7.87") for the best MRT performance. It’s formulated with an epoxy-based resin, cures when exposed to heat and demonstrates low stress and low bleed.