LOCTITE® ABLESTIK ICP 3920
A 1-part, low-temperature curing, electrically conductive die-attach adhesive designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
