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A 1-part, thixotropic coating liquid that provides components on PCBs a flexible, low Tg encapsulation material.

LOCTITE® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It’s ideal for CSP and BGA package applications, formulated with an epoxy-based resin, and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.