
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.