LOCTITE® ECCOBOND UF 3810
This reworkable epoxy underfill provides excellent mechanical properties to protect solder joints during thermal cycling.
LOCTITE® ECCOBOND UF 3810 is a 1-part reworkable epoxy underfill designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical properties to protect solder joints during thermal cycling. You can expect stable electrical performance even in humid conditions.
