LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders, is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
