VIGON A201
Water-based, alkaline defluxing agent for spray-in-air processes
The MPC®-based cleaning agent is especially suitable for the removal of flux residues from leaded as well as lead-free No-Clean solder pastes and provides shiny solder joints after cleaning without the need for additives. It provides excellent cleaning performance in spray-in-air processes for the cleaning of capillary spaces, e.g. under low standoff components.
