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Call Us At:
+66 2 150-0247 to 51
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sales@vlk.th.com
cs1@vlk.th.com
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36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
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BERGQUIST® GAP PAD® TGP 1500R
BERGQUIST® GAP PAD® TGP 1500R
BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
GAP PAD
BERGQUIST® GAP PAD® TGP 2000
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced gap filling material is recommended for low-stress applications requiring a mid to high thermally conductive interface material.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
BERGQUIST® GAP PAD® TGP 2000SF
BERGQUIST® GAP PAD® TGP 2000SF
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
Silicone-Free
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 2101SF
BERGQUIST® GAP PAD® TGP 2101SF
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material
Silicone-Free
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
Silicone-Free
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
BERGQUIST® GAP PAD® TGP 2400
BERGQUIST® GAP PAD® TGP 2400
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
BERGQUIST® GAP PAD® TGP 2700
BERGQUIST® GAP PAD® TGP 2700
BERGQUIST GAP PAD TGP 2700, Thermally Conductive, Un-Reinforced Gap Filling Material
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 3000
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
3.0 – 4.9 W/M·k
BERGQUIST® GAP PAD® TGP 3004SF
BERGQUIST® GAP PAD® TGP 3004SF
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
Silicone-Free
Non-Curing / Pre-Cured
Single Component
3.0 – 4.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 3500ULM
BERGQUIST® GAP PAD® TGP 3500ULM
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
Silicone
Non-Curing / Pre-Cured
Single Component
3.0 – 4.9 W/M·k
< 0.5 Mm
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