VLK Techno Trade company logo
A panel of certificates
A telephone icon
Call Us At:
+66 2 150-0247 to 51
A mail icon
sales@vlk.th.com
cs1@vlk.th.com
A location icon
36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
Filter By

Showing results of items

Reset All
An arrow icon
Application Method
An arrow icon
Brand/Series
An arrow icon
Chemistry Base
An arrow icon
Cure Type
An arrow icon
Electrical Property
An arrow icon
Hardness (Shore)
An arrow icon
Number of Components
An arrow icon
Thermal Conductivity (W/m·K)
An arrow icon
Thickness Range (mm)
BERGQUIST® GAP FILLER TGF 3600
BERGQUIST® GAP FILLER TGF 3600
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.
Silicone
Room-Temperature (RTV)
Heat Cure
Two Component
3.0 – 4.9 W/M·k
BERGQUIST® GAP FILLER TGF 4000
BERGQUIST® GAP FILLER TGF 4000
This highly thermally conductive liquid gap filler offers easy, precision dispensing, low stress assembly, and excellent low- and high-temperature, mechanical and chemical stability.
Non-Curing / Pre-Cured
Room-Temperature (RTV)
Heat Cure
Two Component
3.0 – 4.9 W/M·k
BERGQUIST® GAP FILLER TGF 4400LVO
BERGQUIST® GAP FILLER TGF 4400LVO
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler is designed for control units and ADAS components, and offers highly reliable thermal management and robust processing.
Silicone
Room-Temperature (RTV)
Two Component
GAP Filler
BERGQUIST® GAP FILLER TGF 4500CVO
BERGQUIST® GAP FILLER TGF 4500CVO
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers controlled volatile outgassing for silicone sensitive applications.
Silicone
Room-Temperature (RTV)
Heat Cure
Two Component
3.0 – 4.9 W/M·k
BERGQUIST® GAP PAD® TGP 10000ULM
BERGQUIST® GAP PAD® TGP 10000ULM
This high performance, thermally conductive, silicone-based gap pad filler has an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
Silicone
Non-Curing / Pre-Cured
Single Component
8.0 – 11.9 W/M·k
GAP PAD
BERGQUIST® GAP PAD® TGP 1000VOUS
BERGQUIST® GAP PAD® TGP 1000VOUS
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
BERGQUIST® GAP PAD® TGP 1000VOUSB
BERGQUIST® GAP PAD® TGP 1000VOUSB
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
GAP PAD
BERGQUIST® GAP PAD® TGP 1300
BERGQUIST® GAP PAD® TGP 1300
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 1300U
BERGQUIST® GAP PAD® TGP 1300U
BERGQUIST GAP PAD TGP 1300U, Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
GAP PAD
BERGQUIST® GAP PAD® TGP 1500
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
Silicone
Non-Curing / Pre-Cured
Single Component
1.0 – 2.9 W/M·k
< 0.5 Mm
Thank you! Your submission has been received!
Oops! Something went wrong while submitting the form.