Stabilize advanced packages and boost drop/thermal cycling performance with production-proven underfills. We offer one-part, epoxy-based capillary and no-flow systems—halogen-free, low-viscosity, and high-purity—for void-free flow under tight gaps and fine bump pitches. Options include snap/fast-cure for throughput, reworkable grades for serviceability, and strong adhesion to silicon, FR-4, solder mask, and component metals. Compatible with Pb-free reflow and designed to control stress, reduce warpage, and protect against moisture/mechanical shock.
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